LED display solution to the problem of heat treatment

Shenzhen MingHongWei technology co., LTD. Has been committed to LED display of heat dissipation and energy saving.

In the global energy shortage and environmental pollution aggravate today, LED electronic display screen for its characteristics of energy conservation and environmental protection has a broad application space. LED lamps and lanterns of LED components, heat dissipation structure, drive, lens. If the LED device cannot very good heat dissipation, its life will be affected. Test report according to the Cree XLamp XR - E, LED device, the lower the temperature, the more can prolong the service life of LED lights. Therefore, solving the problem of heat management has become the key of high brightness LED application.

However, how much of the LED light source heat is not the major problems affecting the LED, heat concentration (hot forming) is the key to the problem. In terms of the general standard of LED components, LED device heat flux is about 1 w 100 w/cm2, 3 w LED device heat flux 300 w/cm2, and general CPU heat flux for 60 ~ 130 w/cm2. Heat concentrated in size small chip, chip temperature, the distribution of thermal stress caused by uneven, chips and luminous efficiency fluorescent powder emission efficiency decline. When the temperature exceeds a certain value, the device failure rate law of exponential increase. When multiple dense array of white light LED lighting system, the thermal problem is more serious.

Approaches of heat dissipation of LED devices are heat conduction and thermal convection. Traditionally, LED lamps and lanterns, heat dissipation structure including basement, heat sinks and radiators. Basal to grain of heat conduction, thermal conductivity but not conductive. Fin heat will spread, in order to avoid heat accumulation in the LED light source, and can improve the efficiency of the radiator. Heat radiator can effectively spread in the air. Base material is extremely low thermal conductivity, however, thermal resistance, easy to cause the device to produce serious since the heating effect, destructive influence on the performance and reliability of the device.

Microloops (Michael) soaking plate (Vapor Chamber) can achieve high heat flux heat transfer, can solve the hot issues of high power LED. Soaking plate is an internal microstructure of the vacuum chamber, when the heat from the heat conduction to evaporation zone, the inside of the cavity working substance in the environment of low vacuum, will begin to produce the phenomenon of liquid gasification, the dielectric absorption heat and rapid expansion volume, gas phase medium will soon fill the cavity. When the gas phase medium come into contact with a colder area will produce the phenomenon of condensation, released by the phenomenon of condensation accumulation of heat in evaporation, condensation of liquid medium will borrow by microstructure capillarity back to evaporation heat source. This operation will be inside the cavity and the process continues, this is soaking plate works. As a result of working substance in evaporation microstructure can produce capillary force, so the soaking board operations is not affected by gravity.

This will LED devices directly binding in soaking method has obvious advantages. LED down to the bottom of the device and soaking contact plate, by soaking slab spread point heat source and can effectively transfer heat to the back end, so as to decrease the temperature of hot Tj, the life of the LED. In addition, this method can also be put centrally LED devices, let light concentration, secondary optical design. And use SMD encapsulation of soaking board can also use the SMD automation equipment for mass production. Led display (shenzhen)

In addition to the application in high power LED street light, the current solution soaking board is mainly used in power semiconductor cooling, blade servers, graphics display card, telecommunications infrastructure, power amplifier, radar transmitting module, satellite and laptops. Maike soaking board size and shape can be customized, the minimum thermal resistance is low to 0.05 degrees per watt, thickness of less than 3 mm. The company also developed can handle over 300 w heat power soaking slab to solve the heat dissipation problem high-end graphics CARDS. Soaking ultra-thin design can provide 3.0 mm thickness plate can provide 150 w for single slot image card cooling capacity.